Set to take the market by storm – the new Chip-on-Board (COB) technology will be launched to the mainstream market in 2018, and will revolutionise the way that LED can be used in rental and fixed installation applications.
But what is COB and why are we so excited about this new technology?
COB is the next generation of LED display technology where, instead of the standard SMD that we currently see on most LED panels, the LED chips are directly encapsulated onto the LED module PCB, and then is coated with an epoxy resin to act as a plastic sealed coating.
So, what does this mean for our customers?
This new development comes with an array of brand new features and benefits that make it the perfect Narrow Pixel Pitch (NPP) product for applications such as live events, exhibitions, and even corporate and retail installations.
COB technology halves pixel failure rate by 50% compared to the use of SMD technology, by completely eliminating the high temperature reflow solder process and physical points of failure between the SMD package, and PCB board. This means that the panel is more efficient and has a longer lifespan, and continues to produce stunning visual quality.
The benefits also include; ultra-wide viewing angles due to the RGB diodes no longer requiring packaging, high colour performance and uniformity, and optical seam blending for the ultimate viewing experience.
This reliable and durable product is set to transform the rental market as it offers a NPP solution that can withstand the challenging environments within live events.
We are excited to announce that Absen will be launching their 1mm COBALT with Nanoshield technology at ISE – stay tuned to find out more!
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